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Physical character:

Atomic Weight: 118.69       Melting Point: mp: 232 ¡ãC       Boiling Point: bp:  2260 ¡ãC

It is mainly used in the manufacture of compound semiconductor, High purity alloy, superconducting material, Solder and as a dopant of compound semiconductor.

Content below:

Purity(%)
As
Fe
Cu
Pb
Bi
Sb
Cd
Zn
Al
Total
99.99
0.0005
0.0025
0.0005
0.0035
0.0025
0.002
0.0003
0.0005
0.0005
0.01
99.95
0.003
0.004
0.004
0.01
0.006
0.014
0.0005
0.0008
0.0008
0.05
99.90
0.008
0.0025
0.008
0.04
0.015
0.02
0.0008
0.001
0.001
0.1


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